Wafer-Level Hysteresis Loop Measurement Instrument

Classification

Keywords

Product Model:

Wafer-MOKE

Product Introduction:

Using polar/longitudinal magneto-optical Kerr effects (MOKE) this instrument rapidly and globally detects the magnetism of wafer films. Non-contact measurement avoids wafer damage and is suitable for post-patterning sample testing in spin chip production. It provides a vertical magnetic field of up to 2.5 T and an in-plane magnetic field of up to 1.4 T, with strong magnetic fields inducing free and reference layer flipping in vertically anisotropic magnetic random access memory (MRAM) film stacks. Ultra-high Kerr detection sensitivity allows single-time characterization of subtle magnetic changes in different film layers. Combining laser point-by-point probing with scanning imaging enables rapid creation of global wafer magnetic characteristic maps, aiding process optimization and yield control.

Sample Size	Compatible with 12-inch and below, supports fragment testing
Magnetic Field	Vertical ±2.4 T; In-plane±1.3 T
Magnetic Field Resolution	0.01 mT
Magnetic Field Uniformity	Better than±1%@φ1 mm
Kerr Angle Resolution	0.3 mdeg (RMS)
Testing Efficiency	12 WPH@±1.3 T/9 sites measurement/200 mm wafer
Sample Repeatability	Betterthan 10 μm
Uptime	90%
EFEM	Optional
Testing Functions	Non-destructive hysteresis loop measurement of magnetic film stacks/devices, automatic extraction of hysteresis loop information (free layer and pinned layer Hc, Hex, Ms: (Kerr angle value)), and rapid mapping of wafer magnetic characteristic distribution

- Hysteresis Loop MeasurementResults of Vertical MRAM FilmStacks
- Hysteresis Loop MeasurementResults of In-Plane AnisotropicMTJ Film Stacks
- Different Scanning Modes
- Magnetic Field CharacteristicDistribution Map of 12-InchVertically Anisotropic Wafer