Wafer-Level Magnetron Sputtering Series

Classification

Keywords

Product Model:

MSI-200

Product Overview:

The wafer-level magnetron sputtering system is a series of high-performance and high-efficiency magnetron sputtering equipment developed for laboratories and production lines of manufacturers. The MSI-200 magnetron sputtering equipment is designed to interconnect numerous vacuum chambers within a multi-chamber cluster system, allowing wafer transfer via an integrated three-dimensional manipulator. It is compatible with a wide range of sputtering and processing chambers, making it ideal for both production and experimental lines.

Wafer size	8 inch, downward compatible
Film-coating uniformity	±3%
Ultimate vacuum	5 × 10-9 mbar (sputtering chamber)
Temperature control	RT–1,000°C
Number of cathodes	Six to twelve 4-inch cathodes, customizable multi-chamber design as needed
System composition	LL, Cluster, and sputtering chamber
Power supply	DC, RF, DC Pulse
Deposition accuracy	0.1 nm
Area	L×W×H: 5 m × 4 m × 2 m
Optional	The plasma cleaning chamber, oxidation chamber, three-dimensional manipulator, sample injection chamber, etc. are optional